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Physics Overview ​

MOSFET Operating Principles ​

The Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) is the fundamental building block of modern integrated circuits. It controls current flow through a channel region between source and drain terminals. The channel conductivity is modulated by the electric field from the gate electrode, which is separated from the channel by a thin gate oxide.

Basic Structure ​

A MOSFET consists of four terminals:

TerminalFunction
Gate (G)Controls channel conductivity via electric field
Source (S)Carrier injection point
Drain (D)Carrier collection point
Body (B)Substrate contact, affects threshold voltage

Key Concepts ​

Threshold Voltage ( ) ​

The threshold voltage is the gate voltage required to create a conductive inversion layer (channel). It depends on several factors:

  • Flat-band voltage:
  • Surface potential: (for strong inversion)
  • Body effect:

Where:

  • : Metal-semiconductor work function difference
  • : Fixed oxide charge
  • : Oxide capacitance per unit area
  • : Fermi potential
  • : Body effect coefficient

Operating Regions ​

The MOSFET operates in three distinct regions depending on bias conditions:

RegionConditionBehavior
CutoffChannel not formed, only subthreshold leakage
Linear (Triode) , Acts like a voltage-controlled resistor
Saturation , Channel pinched off, current nearly constant

I-V Characteristics ​

The following chart shows typical MOSFET output characteristics (Id vs Vds) for different gate voltages:

The transfer characteristic (Id vs Vgs) shows how current varies with gate voltage:

Subthreshold Conduction ​

Below threshold, the current doesn't go to zero immediately. The subthreshold swing (SS) characterizes how sharply the transistor turns off:

Where is the body factor.

The ideal SS at room temperature is approximately 60 mV/decade, meaning a 60mV change in Vgs changes drain current by 10×.

Why 60 mV/decade?

At T = 300K, mV. Multiplied by , this gives mV. This is the theoretical minimum for conventional MOSFETs due to Boltzmann statistics of carrier injection.

Energy Band Diagram ​

Understanding the MOS band diagram is crucial for device physics. The diagram below shows the energy bands in inversion:

Different bias conditions create different band configurations:

Bias ConditionSurface StateBand Bending
AccumulationMajority carriers accumulateBands bend toward Ef
Flat-bandNo band bendingBands are flat
DepletionSurface depletedBands bend away from Ef
InversionMinority carriers at surfaceStrong bending,

Capacitance-Voltage Characteristics ​

The MOS capacitor exhibits three distinct regions in C-V measurements:

C-V Regions Explained ​

  1. Accumulation ( ): Majority carriers pile up at the surface

    • (maximum capacitance)
  2. Depletion ( ): Surface depleted of carriers

    • (series combination)
  3. Inversion ( ): Minority carriers form inversion layer

    • High frequency: Inversion charge can't follow AC signal,
    • Low frequency: Inversion charge responds,

Material Parameters ​

Silicon Properties at 300K ​

PropertySymbolValueUnit
Band gap1.12eV
Dielectric constant11.7-
Intrinsic carrier concentrationcm⁻³
Electron mobility1400cm²/V·s
Hole mobility450cm²/V·s
Electron saturation velocitycm/s
Hole saturation velocitycm/s

Gate Dielectric Materials ​

MaterialDielectric Constant ( )Band Gap (eV)EOT Factor
SiO₂3.99.01.0
Si₃N₄7.55.30.52
HfO₂255.80.16
ZrO₂255.80.16

High-k Dielectrics

High-k materials like HfO₂ allow thicker physical oxide for the same , reducing gate leakage while maintaining electrostatic control. The Equivalent Oxide Thickness (EOT) relates physical thickness to SiO₂ equivalent:

Temperature Effects ​

Temperature significantly affects MOSFET characteristics:

ParameterTemperature Dependence
Increases exponentially with T
Decreases with T (phonon scattering)
Decreases ~2 mV/K
Increases exponentially with T
Decreases slightly with T

The threshold voltage temperature coefficient is approximately:

Physics Model Levels ​

The simulator implements three levels of physics modeling:

LevelModel TypeSpeedAccuracyUse Case
AAnalyticalFastBasicLearning, quick analysis
BSemi-empiricalFastGoodDevice design, SCE analysis
CNumericalSlowHighResearch, validation

See the detailed documentation for each level: